With a 320-bit memory bus and a possible 10GB of GDDR6 … the up-coming Xbox Series X is gonna kick some serious butt!
Taken from TPU … Microsoft’s upcoming Xbox Series X entertainment system is shaping up to be a technological monstrosity. Xbox group head at Microsoft, Phil Spencer, last revealed a picture of its semi-custom SoC back in January, by setting it as his Twitter display picture. Over the following weeks, many more technical details, such as the chip’s 12 TFLOP/s combined compute power, would be let out. Spencer updated his display picture revealing a segment of the Xbox Series X mainboard with the SoC and memory chips surrounding it. The picture reveals the large SoC package in the center, surrounded on three sides by ten memory chips, possibly GDDR6, each with its own wiring to the SoC. This indicates that the SoC features a 320-bit wide memory interface.
As for the memory density, there’s no way to tell. It could be 10 GB if those are 8 Gbit memory chips, or 20 GB if those are 16 Gbit. It boils down to which device the Xbox Series X the company wants to succeed. The Xbox One S features 8 GB of DDR3, while the spruced up Xbox One X features 12 GB of GDDR5. If the new Xbox Series X succeeds the latter, then it could very well feature 20 GB, more so given Microsoft’s lofty design goals (4K UHD gaming with real-time ray-tracing). Microsoft leverages hUMA to use a common memory pool for both the CPU and GPU. Designed in collaboration with AMD on a TSMC 7 nm-class node (likely the N7P), the SoC features “Zen 2” CPU cores, and a GPU based on the RDNA2 graphics architecture.