Not sure if that’s a good idea … unless they know something that we don’t. AMD/Radeon chips can run pretty hot especially at full load. Who knows … maybe these new revisions will use newer low voltage chips instead.
Taken from TPU … Sony’s latest gaming console, PlayStation 5, has been selling at loss up until August 4th, when the company announced that the new console is now profitable. However, it seems like Sony is trying to extend those profits even further with the latest revision of PlayStation 5 that is seemingly taking a step backward. According to the latest report, Sony has updated its PlayStation 5 internal design and the console is now featuring a smaller heatsink, which you can see below. The new revision is featuring a significantly smaller heatsink and an abundance of the large copper cold plate. The fan that cools the heatsink is also reduced, resulting in a complete thermal downgrade.
While there was no in-depth testing of the cooling performance, the exhaust system of the new PS5 revision is spitting out 3-5 degrees Celsius higher temperatures. That is just measuring the air coming out, where the actual SoC could run hotter by an even larger margin. As we wait for more testing of the new PS5 revisions, we have to wonder why Sony opted to cut corners on such an important piece, that ultimately provides the console with longevity, due to cooler silicon.